This revolutionary NASA-developed material will reduce thermal imaging heat signatures by 97%. Each layer of material is bonded to polyurethane for strength and durability and has a inner layer of insulation to prevent conductive heat flow.
Specifications
| EACH | CASE | MASTER CASE | PALLET | |
|---|---|---|---|---|
| UPC: | 816731011204 | 816731011204 | 816731011204 | 816731011204 |
| Qty: | 1.0 | 1.0 | 0.0 | 38.0 |
| Weight (lb): | 6 | 0.0 | 0.0 | – |
| Width (in): | 10.0 | 0.0 | 0.0 | – |
| Height (in): | 48.0 | 0.0 | 0.0 | – |
| Length (in): | 10.0 | 0.0 | 0.0 | – |
