This revolutionary NASA-developed material will reduce thermal imaging heat signatures by 97%. Each layer of material is bonded to polyurethane for strength and durability and has a inner layer of insulation to prevent conductive heat flow.
Specifications
EACH | CASE | MASTER CASE | PALLET | |
---|---|---|---|---|
UPC: | 816731011204 | 816731011204 | 816731011204 | 816731011204 |
Qty: | 1.0 | 1.0 | 0.0 | 38.0 |
Weight (lb): | 6 | 0.0 | 0.0 | – |
Width (in): | 10.0 | 0.0 | 0.0 | – |
Height (in): | 48.0 | 0.0 | 0.0 | – |
Length (in): | 10.0 | 0.0 | 0.0 | – |